Le groupe Tengfei se concentre sur l'innovation et l'application technologiques des sous-vêtements sans couture.
Advanced Manufacturing & Performance Design
· Tape Bonding | Senselast
· Bonding | Silicon Bonding | 3D
· Printing | Senselast Flocking |
· Slimming| Cup Molding
Layout 0f Phase 1
· Factory Area :57000㎡
· Office Area : 4000 ㎡
· R&D Area : 1200 ㎡
Exterior (Phase 1)
Building A ( Phase 1 )
· Show room
· Meeting room
· Office
· Dormitory
· Complete on Oct. 2025
Building B ( Phase 1 )
Workshop C
· Completed on Mar. 2025
· Building Area : 15,000 ㎡
· Function: Cutting +Senselast Bonding+Flocking+ Sewing +Tape Bonding
· Capacity: 300,000 Units
Workshop D
Workshop E
· Will be completed on Oct. 2025
· Building Area: 15,000 ㎡
· Function: warehouse +cutting +Senselast Bonding+Flocking+ Sewing +Tape Bonding
· Capacity: 300,000 Units